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  RENICE X3 1.8 inch micro SATA MLC SSD

Renice X3 series 1.8" MicroSata Industrial Grade SSD is a high performance and high capacity mass storage solution in 1.8 inch form factor with Micro Sata connector. It's perfect for industrial applications such as transportation, industrial PC, healthcare, telecommunications, and other harsh environments where data integrity and consistent performance is mission critical.

 Features:
- Form Factor: 1.8 inch
- Interface: 7+7+2pin MicroSATA SATAII 3.0Gb/s
- Capacity: 25GB, 60GB, 120GB, 240GB(MLC)
25GB, 60GB(SLC)
- Housing: Complete metal housing
- Dimension: 78.5x54x5mm
- NCQ up to 32 commands
- RAID Support
- TRIM Support
 
Performance:
- Max Read Rate: 285MB/sec
- Max Write Rate: 275MB/sec
- 4kb Random Read/Write IOPS: 30,000/10,000
- Access Time: 0.1ms
 
Power Consumption and Environment
- Input voltage: 3.3V±5%
- Idle: <0.75W
- Active: <0.9W
- Operating temperature: 0 to 70°C (Commercial)
-40 to 85°C (Industrial)
- Storage temperature: -40 to 85°C
- Shock Endurance: 2,000G
- Vibration Endurance: 20G
 
Reliability:
- Hardware Encryption: AES-128bit
- MTBF: >2,000,000 hours
- High and Reliable ECC capability up to 24bits/sector
- S.M.A.R.T features optimized for SSD
- Bit error monitoring and managent
- Dynamic and static wear-leveling
- Dynamic bad block management
- SMART commands and additional SSD monitoring

 

 

 
 
Footnotes:

1. 1GB = 1,000,000,000 bytes. Some capacity not available for data storage.
2. Approximations based on LDE (Long-term Data Endurance) - an industry metric,introduced by Renice,that  quantifies how much

data can be written to a SSD in its lifespan expressed in terabytes written (TBW). Data is written using typical PC transfer size ,

written at a constant rate over the life of the SSD and data is retained for at least 1 year upon LDE exhaustion. Based on Renice

internal measurements, a typical client PC user writes 4GB/day.
3. MTBF - Mean time before failures based on part stress analysis.
4. Assumes DIPM (Device Initiated Power Management) is enabled.
5. Dimensions and Weight vary based on form factor type and capacity.

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