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RENICE X2 1.8 inch micro SATA SLC SSD
Renice X2 series 1.8” Micro Sata Industrial Grade SSD drive is an optimal time-to-market replacement for hard drives and flash cards in host systems that require low power and scalable solutions. Utilizing the option of MLC and SLC Nand Flash components, Renice 1.8” Micro Sata industrial Grade SSD offers an extended operating temperature range of -40 to 85°C , provides outstanding performance and proven reliability for products operating outside the standard temperature grange.

 
Features:
- Form Factor: 1.8 inch
- Interface: 7+7+2pin MicroSATA SATAII 3.0Gb/s
- Capacity: 16GB~256GB (MLC)
                     8GB~128GB (SLC)
- Housing: Complete metal housing
- NCQ up to 32 commands
- RAID Support
- TRIM Support
 
Performance:
- Max Read Rate: 250MB/sec
- Max Write Rate: 200MB/sec
- 4kb Random Read IOPS: 10,000
- Access Time: 0.1ms
 
Power Consumption and Environment
- Input voltage: 3.3V±5%
- Idle: <0.33W
- Read: <0.95W
- Write: <1.42W
- Operating temperature: 0 to 70°C (Commercial) -40 to 85°C (Industrial)
- Storage temperature: -50 to 95°C
- Shock Endurance: 2,000G
- Vibration Endurance: 20G
 
Reliability:
- MTBF: >1,500,000 hours
- High and Reliable ECC capability up to 16bits/sector
- S.M.A.R.T features optimized for SSD
- Bit error monitoring and managent
- Dynamic and static wear-leveling
- Dynamic bad block management
- SMART commands and additional SSD monitoring
 
 
Footnotes:

1. 1GB = 1,000,000,000 bytes. Some capacity not available for data storage.
2. Approximations based on LDE (Long-term Data Endurance) - an industry metric,introduced by Renice,that  quantifies how much

data can be written to a SSD in its lifespan expressed in terabytes written (TBW). Data is written using typical PC transfer size ,

written at a constant rate over the life of the SSD and data is retained for at least 1 year upon LDE exhaustion. Based on Renice

internal measurements, a typical client PC user writes 4GB/day.
3. MTBF - Mean time before failures based on part stress analysis.
4. Assumes DIPM (Device Initiated Power Management) is enabled.
5. Dimensions and Weight vary based on form factor type and capacity.

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